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·············································································· （252 ）
3。10。3 芯片封装与引脚功能·································································································· （253 ）
3。10。4 内部结构与工作原理·································································································· （255 ）
3。10。5 应用电路设计·············································································································· （256 ）
3。11 915MHz OOK 收发器模块RD0300 的原理与应用电路设计················································· （259 ）
3。11。1 概述······························································································································ （259 ）
3。11。2 主要性能指标·············································································································· （259 ）
3。11。3 内部结构与引脚功能··································································································· （259 ）
3。11。4 模块内部电路·············································································································· （262 ）
第4 章 无线通信射频前端芯片的原理与应用电路设计············································· （265 ）
4。1 蓝牙无线收发器芯片SiW1701 的原理与应用电路设计··········································································· （265 ）
4。1。1 概述······························································································································· （265 ）
4。1。2 主要技术指标················································································································ （265 ）
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4。1。3 芯片封装与引脚功能···································································································· （267 ）
4。1。4 内部结构与工作原理···································································································· （270 ）
4。1。5 应用电路设计················································································································ （271 ）
4。2 900MHz 无绳电话射频前端芯片MAX2420/ 21/22/60/63 的原理与应用电路设计················ （273 ）
4。2。1 概述······························································································································· （273 ）
4。2。2 主要性能指标················································································································ （273 ）
4。2。3 芯片封装与引脚功能···································································································· （274 ）
4。2。4 内部结构与工作原理···································································································· （275 ）
4。2。5 应用电路设计················································································································ （275 ）
4。3 全球定位系统GPS 接收机射频芯片MAX2740 的原理与应用电路设计·····························�