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3。6。5 应用电路设计················································································································ （222 ）
3。7 433/868/915MHz FSK/ASK/OOK 收发器芯片RF2945 的原理与应用电路设计····················· （225 ）
3。7。1 概述······························································································································· （225 ）
3。7。2 主要技术指标················································································································ （225 ）
3。7。3 芯片封装与引脚功能···································································································· （226 ）
3。7。4 内部结构与工作原理···································································································· （229 ）
3。7。5 应用电路设计················································································································ （229 ）
3。7。6 电路设计实例················································································································ （232 ）
3。8 315 / 433 / 868/ 915 MHz FSK 内嵌8051 微控制器的收发器芯片CC1010 的原理与应用电路设计····· （235 ）
3。8。1 概述······························································································································· （235 ）
3。8。2 主要性能指标················································································································ （235 ）
3。8。3 芯片封装及引脚功能···································································································· （236 ）
3。8。4 内部结构与工作原理···································································································· （238 ）
3。8。5 应用电路设计················································································································ （239 ）
3。9 315。00 MHz OOK 收发器模块DR3101 的原理与应用电路设计············································· （245 ）
3。9。1 概述······························································································································· （245 ）
3。9。2 主要技术指标················································································································ （245 ）
3。9。3 芯片封装及引脚功能···································································································· （245 ）
3。9。4 内部结构及工作原理···································································································· （248 ）
3。9。5 应用电路设计················································································································ （251 ）
3。10 2。4GHz DSSS 收发器芯片组RFW302 原理与应用电路设计················································ （252 ）
3。10。1 概述····························································································································· （252 ）
3。10。2 主要技术指标··················································································