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1。8。2 主要技术指标·················································································································· （48 ）
1。8。3 芯片封装与引脚功能······································································································ （49 ）
1。8。4 内部结构与工作原理······································································································ （50 ）
1。8。5 应用电路设计·················································································································· （51 ）
1。9 868 MHz/915 MHz AM/ASK/OOK 发射器芯片RF2514 的原理与应用电路设计····················· （57 ）
1。9。1 概述································································································································· （57 ）
1。9。2 主要技术指标·················································································································· （57 ）
1。9。3 芯片封装与引脚功能······································································································ （57 ）
1。9。4 内部结构与工作原理······································································································ （59 ）
1。9。5 应用电路设计·················································································································· （60 ）
1。10 315MHz 遥控无键进入系统发射器模块DK1000T 的原理与应用电路设计··························· （68 ）
1。10。1 概述······························································································································· （68 ）
1。10。2 主要技术指标················································································································ （68 ）
1。10。3 模块封装与引脚功能···································································································· （68 ）
1。10。4 内部结构与工作原理···································································································· （70 ）
1。10。5 应用电路设计················································································································ （71 ）
1。11 310MHz～440MHz ASK 发射器芯片U2745 的 原理与应用电路设计································· （74 ）
1。11。1 概述································································································································ （74 ）
1。11。2 主要性能指标················································································································ （74 ）
1。11。3 芯片封装与引脚功能····································································································· （75 ）
1。11。4 内部结构与工作原理····································································································· （75 ）
1。11。5 应用电路设计·······························································································